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Chipbond Technology Corporation (颀邦科技)

Main Activities: Computer and Electronic Product Manufacturing

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Company Information

Full name
Chipbond Technology Corporation (颀邦科技)

Headquarters
3, Li Hsin 5th Rd., SBIP, Hsinchu, Taiwan; Hsinchu County; Hsinchu County
Status: Listed
Legal Form: Public Limited Company
Operational Status: Operational
ISIN CODE : TW0006147002
Financial Auditors: PricewaterhouseCoopers (2014)
Incorporation Date: July 2, 1997
Total Employees: 3,076

Tel: 886-3-5678788

Company Description

Chipbond was established in 1997 July 2nd and was booked on the Taiwan Stock Exchange starting from 2002 January 31st. Chipbond Technology Corporation is the only company in Taiwan to supply a true full Turnkey Service for backend assembly processing of LCD driver ICs from wafer bumping to packaging. There are two fabs in operation, the LiHsin Plant and the Prosperity Plant are both located within the Hsinchu Science Park. Wafer bumping is conducted in LiHsin Plant whilst the subsequent backend processing
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Key Executives

Wu Fui Chien Chairman of the Board of Directors
Kao Huo Wen President
Luo Shi Wei Spokesperson
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